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Journal: Processes, 2023
Volume: 11
Number: 506

Article: A Laser Shock-Based Disassembly Process for Adhesively Bonded Ti/CFRP Parts
Authors: by Panagiotis Kormpos, Selen Unaldi, Laurent Berthe and Konstantinos Tserpes
Link: https://www.mdpi.com/2227-9717/11/2/506

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