Wang, B.; Yang, D.; Zhu, X.; Zhao, Y.; Wang, S.; Zhu, J.; Zhai, M.
Effect of Positive Bias and Pressure on Plasma Flow Characteristics in a Chemical Vapor Deposition Chamber. Processes 2022, 10, 2665.
https://doi.org/10.3390/pr10122665
AMA Style
Wang B, Yang D, Zhu X, Zhao Y, Wang S, Zhu J, Zhai M.
Effect of Positive Bias and Pressure on Plasma Flow Characteristics in a Chemical Vapor Deposition Chamber. Processes. 2022; 10(12):2665.
https://doi.org/10.3390/pr10122665
Chicago/Turabian Style
Wang, Bisheng, Di Yang, Ximing Zhu, Yang Zhao, Shuai Wang, Jiaqi Zhu, and Ming Zhai.
2022. "Effect of Positive Bias and Pressure on Plasma Flow Characteristics in a Chemical Vapor Deposition Chamber" Processes 10, no. 12: 2665.
https://doi.org/10.3390/pr10122665
APA Style
Wang, B., Yang, D., Zhu, X., Zhao, Y., Wang, S., Zhu, J., & Zhai, M.
(2022). Effect of Positive Bias and Pressure on Plasma Flow Characteristics in a Chemical Vapor Deposition Chamber. Processes, 10(12), 2665.
https://doi.org/10.3390/pr10122665