Suchý, T.; Vištejnová, L.; Šupová, M.; Klein, P.; Bartoš, M.; Kolinko, Y.; Blassová, T.; Tonar, Z.; Pokorný, M.; Sucharda, Z.;
et al. Vancomycin-Loaded Collagen/Hydroxyapatite Layers Electrospun on 3D Printed Titanium Implants Prevent Bone Destruction Associated with S. epidermidis Infection and Enhance Osseointegration. Biomedicines 2021, 9, 531.
https://doi.org/10.3390/biomedicines9050531
AMA Style
Suchý T, Vištejnová L, Šupová M, Klein P, Bartoš M, Kolinko Y, Blassová T, Tonar Z, Pokorný M, Sucharda Z,
et al. Vancomycin-Loaded Collagen/Hydroxyapatite Layers Electrospun on 3D Printed Titanium Implants Prevent Bone Destruction Associated with S. epidermidis Infection and Enhance Osseointegration. Biomedicines. 2021; 9(5):531.
https://doi.org/10.3390/biomedicines9050531
Chicago/Turabian Style
Suchý, Tomáš, Lucie Vištejnová, Monika Šupová, Pavel Klein, Martin Bartoš, Yaroslav Kolinko, Tereza Blassová, Zbyněk Tonar, Marek Pokorný, Zbyněk Sucharda,
and et al. 2021. "Vancomycin-Loaded Collagen/Hydroxyapatite Layers Electrospun on 3D Printed Titanium Implants Prevent Bone Destruction Associated with S. epidermidis Infection and Enhance Osseointegration" Biomedicines 9, no. 5: 531.
https://doi.org/10.3390/biomedicines9050531
APA Style
Suchý, T., Vištejnová, L., Šupová, M., Klein, P., Bartoš, M., Kolinko, Y., Blassová, T., Tonar, Z., Pokorný, M., Sucharda, Z., Žaloudková, M., Denk, F., Ballay, R., Juhás, Š., Juhásová, J., Klapková, E., Horný, L., Sedláček, R., Grus, T.,
... Hrabák, J.
(2021). Vancomycin-Loaded Collagen/Hydroxyapatite Layers Electrospun on 3D Printed Titanium Implants Prevent Bone Destruction Associated with S. epidermidis Infection and Enhance Osseointegration. Biomedicines, 9(5), 531.
https://doi.org/10.3390/biomedicines9050531
