Wang, S.; Song, C.; Zhang, L.; Hu, F.; Dong, F.; Liang, D.; Liu, J.; Zhang, J.; Chen, S.
Cooling Methods for a Typical Printed Circuit Board Assembly in Spacecraft: Simulation and Experiment. Electronics 2025, 14, 314.
https://doi.org/10.3390/electronics14020314
AMA Style
Wang S, Song C, Zhang L, Hu F, Dong F, Liang D, Liu J, Zhang J, Chen S.
Cooling Methods for a Typical Printed Circuit Board Assembly in Spacecraft: Simulation and Experiment. Electronics. 2025; 14(2):314.
https://doi.org/10.3390/electronics14020314
Chicago/Turabian Style
Wang, Sheng, Changxu Song, Li Zhang, Fengjiao Hu, Feng Dong, Dapeng Liang, Jiangtao Liu, Jingyu Zhang, and Sihong Chen.
2025. "Cooling Methods for a Typical Printed Circuit Board Assembly in Spacecraft: Simulation and Experiment" Electronics 14, no. 2: 314.
https://doi.org/10.3390/electronics14020314
APA Style
Wang, S., Song, C., Zhang, L., Hu, F., Dong, F., Liang, D., Liu, J., Zhang, J., & Chen, S.
(2025). Cooling Methods for a Typical Printed Circuit Board Assembly in Spacecraft: Simulation and Experiment. Electronics, 14(2), 314.
https://doi.org/10.3390/electronics14020314