Cheng, Y.; Xu, F.; Xu, L.; Ge, Y.; Yang, J.; Fan, W.; Huang, W.; Liu, W.
FirmVulLinker: Leveraging Multi-Dimensional Firmware Profiling for Identifying Homologous Vulnerabilities in Internet of Things Devices. Electronics 2025, 14, 3438.
https://doi.org/10.3390/electronics14173438
AMA Style
Cheng Y, Xu F, Xu L, Ge Y, Yang J, Fan W, Huang W, Liu W.
FirmVulLinker: Leveraging Multi-Dimensional Firmware Profiling for Identifying Homologous Vulnerabilities in Internet of Things Devices. Electronics. 2025; 14(17):3438.
https://doi.org/10.3390/electronics14173438
Chicago/Turabian Style
Cheng, Yixuan, Fengzhi Xu, Lei Xu, Yang Ge, Jingyu Yang, Wenqing Fan, Wei Huang, and Wen Liu.
2025. "FirmVulLinker: Leveraging Multi-Dimensional Firmware Profiling for Identifying Homologous Vulnerabilities in Internet of Things Devices" Electronics 14, no. 17: 3438.
https://doi.org/10.3390/electronics14173438
APA Style
Cheng, Y., Xu, F., Xu, L., Ge, Y., Yang, J., Fan, W., Huang, W., & Liu, W.
(2025). FirmVulLinker: Leveraging Multi-Dimensional Firmware Profiling for Identifying Homologous Vulnerabilities in Internet of Things Devices. Electronics, 14(17), 3438.
https://doi.org/10.3390/electronics14173438
