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Electronics2024, 13(22), 4356;https://doi.org/10.3390/electronics13224356

Journal: ElectronicsVolume: 13Number: 4356

Article: Analysis of Molding Defection in IC Packaging and Testing Process

Authors:
Bao Rong Chang¹,
Hsiu-Fen Tsai^2,* and
Chen-Chia Chen¹

Link: https://www.mdpi.com/2079-9292/13/22/4356

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