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Journal: ElectronicsVolume: 12Number: 1899
Article: Characterization of Sn-xIn Solders and Thermomigration-Induced Interfacial IMC Growth of Cu/Sn-xIn/Cu Micro Solder Joints
  • Authors:
  • Yanfeng Du,
  • Yuanyuan Qiao and
  • Xiaolei Ren
  • et al.
Link: https://www.mdpi.com/2079-9292/12/8/1899

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