Next Article in Journal
A Novel End-to-End Turkish Text-to-Speech (TTS) System via Deep Learning
Next Article in Special Issue
Synthesized Improvement of Die Fly and Die Shift Concerning the Wafer Molding Process for Ultrafine SAW Filter FOWLP
Previous Article in Journal
Anti-Offset High-Voltage Wireless Power Transfer System Based on Many-to-One Topology
Previous Article in Special Issue
Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications
 
 

Order Article Reprints

Journal: Electronics, 2023
Volume: 12
Number: 1899

Article: Characterization of Sn-xIn Solders and Thermomigration-Induced Interfacial IMC Growth of Cu/Sn-xIn/Cu Micro Solder Joints
Authors: by Yanfeng Du, Yuanyuan Qiao, Xiaolei Ren, Yanqing Lai and Ning Zhao
Link: https://www.mdpi.com/2079-9292/12/8/1899

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Quote and Order Details

Contact Person

Invoice Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop