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Journal: Electronics, 2023
Volume: 12
Number: 1899
Article:
Characterization of Sn-xIn Solders and Thermomigration-Induced Interfacial IMC Growth of Cu/Sn-xIn/Cu Micro Solder Joints
Authors:
by
Yanfeng Du, Yuanyuan Qiao, Xiaolei Ren, Yanqing Lai and Ning Zhao
Link:
https://www.mdpi.com/2079-9292/12/8/1899
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