Ma, J.; Zhang, T.; Yang, C.; Cao, Y.; Xie, L.; Tian, H.; Li, X.
Review of Wafer Surface Defect Detection Methods. Electronics 2023, 12, 1787.
https://doi.org/10.3390/electronics12081787
AMA Style
Ma J, Zhang T, Yang C, Cao Y, Xie L, Tian H, Li X.
Review of Wafer Surface Defect Detection Methods. Electronics. 2023; 12(8):1787.
https://doi.org/10.3390/electronics12081787
Chicago/Turabian Style
Ma, Jianhong, Tao Zhang, Cong Yang, Yangjie Cao, Lipeng Xie, Hui Tian, and Xuexiang Li.
2023. "Review of Wafer Surface Defect Detection Methods" Electronics 12, no. 8: 1787.
https://doi.org/10.3390/electronics12081787
APA Style
Ma, J., Zhang, T., Yang, C., Cao, Y., Xie, L., Tian, H., & Li, X.
(2023). Review of Wafer Surface Defect Detection Methods. Electronics, 12(8), 1787.
https://doi.org/10.3390/electronics12081787