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Journal: ElectronicsVolume: 12Number: 1122
Article: Space-Borne System-in-Package Based on High Reliability Microwave Interconnections
  • Authors:
  • Bin Li1,2,*,
  • Guobin Wan1 and
  • Yun Li2
  • et al.
Link: https://www.mdpi.com/2079-9292/12/5/1122

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