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Journal: Electronics, 2023
Volume: 12
Number: 1122
Article:
Space-Borne System-in-Package Based on High Reliability Microwave Interconnections
Authors:
by
Bin Li, Guobin Wan, Yun Li, Zhaoshen Shao, Guowei Chen, Fengchao Ren and Jiaqi Su
Link:
https://www.mdpi.com/2079-9292/12/5/1122
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