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Journal: Electronics, 2023
Volume: 12
Number: 3154

Article: Advanced Thermal Control Using Chip Cooling Laminate Chip (CCLC) with Finite Element Method for System-in-Package (SiP) Technology
Authors: by Aziz Oukaira, Dhaou Said, Jamal Zbitou and Ahmed Lakhssassi
Link: https://www.mdpi.com/2079-9292/12/14/3154

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