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Journal: ElectronicsVolume: 12Number: 3154
Article: Advanced Thermal Control Using Chip Cooling Laminate Chip (CCLC) with Finite Element Method for System-in-Package (SiP) Technology
- Authors:
- Aziz Oukaira1,*,
- Dhaou Said2 and
- Jamal Zbitou3,4
- et al.
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