Cheng, X.; Wang, Y.; Liu, J.; Ding, W.; Lou, H.; Li, P.
Booth Encoded Bit-Serial Multiply-Accumulate Units with Improved Area and Energy Efficiencies. Electronics 2023, 12, 2177.
https://doi.org/10.3390/electronics12102177
AMA Style
Cheng X, Wang Y, Liu J, Ding W, Lou H, Li P.
Booth Encoded Bit-Serial Multiply-Accumulate Units with Improved Area and Energy Efficiencies. Electronics. 2023; 12(10):2177.
https://doi.org/10.3390/electronics12102177
Chicago/Turabian Style
Cheng, Xiaoshu, Yiwen Wang, Jiazhi Liu, Weiran Ding, Hongfei Lou, and Ping Li.
2023. "Booth Encoded Bit-Serial Multiply-Accumulate Units with Improved Area and Energy Efficiencies" Electronics 12, no. 10: 2177.
https://doi.org/10.3390/electronics12102177
APA Style
Cheng, X., Wang, Y., Liu, J., Ding, W., Lou, H., & Li, P.
(2023). Booth Encoded Bit-Serial Multiply-Accumulate Units with Improved Area and Energy Efficiencies. Electronics, 12(10), 2177.
https://doi.org/10.3390/electronics12102177