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Electronics
Volume 11
Issue 19
10.3390/electronics11193209
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Journal: Electronics, 2022
Volume: 11
Number: 3209

Article: Novel Highly Flexible PCB Design Based on a Via-Less Meander Ground Structure to Transmit mm-Wave RF Signals in 5G Foldable Mobile Products
Authors: by Bumhee Bae, Kwangmo Yang, Younho Kim, Minseok Kim, Younghun Seong, Jaehoon Lee and Jeongnam Cheon
Link: https://www.mdpi.com/2079-9292/11/19/3209

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