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        Journal: Electronics, 2022
        Volume: 11 
                	Number: 3013 
                
        
        Article:
        Heterogeneous and Monolithic 3D Integration Technology for Mixed-Signal ICs 
        Authors: 
       	by
                    Jaeyong Jeong, Dae-Myeong Geum and SangHyeon Kim        
        Link:
        https://www.mdpi.com/2079-9292/11/19/3013
        
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