Ning, J.; Niu, C.; Tang, Z.; Sun, Y.; Yan, H.; Zhou, D.
Optimizing the PECVD Process for Stress-Controlled Silicon Nitride Films: Enhancement of Tensile Stress via UV Curing and Layered Deposition. Coatings 2025, 15, 708.
https://doi.org/10.3390/coatings15060708
AMA Style
Ning J, Niu C, Tang Z, Sun Y, Yan H, Zhou D.
Optimizing the PECVD Process for Stress-Controlled Silicon Nitride Films: Enhancement of Tensile Stress via UV Curing and Layered Deposition. Coatings. 2025; 15(6):708.
https://doi.org/10.3390/coatings15060708
Chicago/Turabian Style
Ning, Jianping, Chunjie Niu, Zhen Tang, Yue Sun, Hao Yan, and Dayu Zhou.
2025. "Optimizing the PECVD Process for Stress-Controlled Silicon Nitride Films: Enhancement of Tensile Stress via UV Curing and Layered Deposition" Coatings 15, no. 6: 708.
https://doi.org/10.3390/coatings15060708
APA Style
Ning, J., Niu, C., Tang, Z., Sun, Y., Yan, H., & Zhou, D.
(2025). Optimizing the PECVD Process for Stress-Controlled Silicon Nitride Films: Enhancement of Tensile Stress via UV Curing and Layered Deposition. Coatings, 15(6), 708.
https://doi.org/10.3390/coatings15060708