You, S.; Yang, H.S.; Jeon, D.; Chae, H.; Kim, C.-K.
Controlling Bowing and Narrowing in SiO2 Contact-Hole Etch Profiles Using Heptafluoropropyl Methyl Ether as an Etchant with Low Global Warming Potential. Coatings 2023, 13, 1452.
https://doi.org/10.3390/coatings13081452
AMA Style
You S, Yang HS, Jeon D, Chae H, Kim C-K.
Controlling Bowing and Narrowing in SiO2 Contact-Hole Etch Profiles Using Heptafluoropropyl Methyl Ether as an Etchant with Low Global Warming Potential. Coatings. 2023; 13(8):1452.
https://doi.org/10.3390/coatings13081452
Chicago/Turabian Style
You, Sanghyun, Hyun Seok Yang, Dongjun Jeon, Heeyeop Chae, and Chang-Koo Kim.
2023. "Controlling Bowing and Narrowing in SiO2 Contact-Hole Etch Profiles Using Heptafluoropropyl Methyl Ether as an Etchant with Low Global Warming Potential" Coatings 13, no. 8: 1452.
https://doi.org/10.3390/coatings13081452
APA Style
You, S., Yang, H. S., Jeon, D., Chae, H., & Kim, C.-K.
(2023). Controlling Bowing and Narrowing in SiO2 Contact-Hole Etch Profiles Using Heptafluoropropyl Methyl Ether as an Etchant with Low Global Warming Potential. Coatings, 13(8), 1452.
https://doi.org/10.3390/coatings13081452