Hsieh, S.T.; Mishra, H.; Bolouki, N.; Wu, W.; Li, C.; Hsieh, J.-H.
The Correlation of Plasma Characteristics to the Deposition Rate of Plasma Polymerized Methyl Methacrylate Thin Films in an Inductively Coupled Plasma System. Coatings 2022, 12, 1014.
https://doi.org/10.3390/coatings12071014
AMA Style
Hsieh ST, Mishra H, Bolouki N, Wu W, Li C, Hsieh J-H.
The Correlation of Plasma Characteristics to the Deposition Rate of Plasma Polymerized Methyl Methacrylate Thin Films in an Inductively Coupled Plasma System. Coatings. 2022; 12(7):1014.
https://doi.org/10.3390/coatings12071014
Chicago/Turabian Style
Hsieh, Stephen T., Himanshu Mishra, Nima Bolouki, Weite Wu, Chuan Li, and Jang-Hsing Hsieh.
2022. "The Correlation of Plasma Characteristics to the Deposition Rate of Plasma Polymerized Methyl Methacrylate Thin Films in an Inductively Coupled Plasma System" Coatings 12, no. 7: 1014.
https://doi.org/10.3390/coatings12071014
APA Style
Hsieh, S. T., Mishra, H., Bolouki, N., Wu, W., Li, C., & Hsieh, J.-H.
(2022). The Correlation of Plasma Characteristics to the Deposition Rate of Plasma Polymerized Methyl Methacrylate Thin Films in an Inductively Coupled Plasma System. Coatings, 12(7), 1014.
https://doi.org/10.3390/coatings12071014