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Journal: Coatings, 2021
Volume: 11
Number: 50
Article:
Engineering Copper Adhesion on Poly-Epoxy Surfaces Allows One-Pot Metallization of Polymer Composite Telecommunication Waveguides
Authors:
by
Fouzi Addou, Thomas Duguet, Yohann Ledru, Didier Mesnier and Constantin Vahlas
Link:
https://www.mdpi.com/2079-6412/11/1/50
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