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Journal: Coatings, 2021
Volume: 11
Number: 50

Article: Engineering Copper Adhesion on Poly-Epoxy Surfaces Allows One-Pot Metallization of Polymer Composite Telecommunication Waveguides
Authors: by Fouzi Addou, Thomas Duguet, Yohann Ledru, Didier Mesnier and Constantin Vahlas
Link: https://www.mdpi.com/2079-6412/11/1/50

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