Choi, H.; Kim, K.; Son, S.; Lee, D.; Je, S.; Kang, J.; Jeong, S.; Kim, D.S.; Lee, M.; Kim, J.;
et al. Cu-Contamination-Free Hybrid Bonding via MoS2 Passivation Layer. Nanomaterials 2025, 15, 1600.
https://doi.org/10.3390/nano15201600
AMA Style
Choi H, Kim K, Son S, Lee D, Je S, Kang J, Jeong S, Kim DS, Lee M, Kim J,
et al. Cu-Contamination-Free Hybrid Bonding via MoS2 Passivation Layer. Nanomaterials. 2025; 15(20):1600.
https://doi.org/10.3390/nano15201600
Chicago/Turabian Style
Choi, Hyunbin, Kyungman Kim, Sihoon Son, Dongho Lee, Seongyun Je, Jieun Kang, Sunjae Jeong, Doo San Kim, Minjong Lee, Jiyoung Kim,
and et al. 2025. "Cu-Contamination-Free Hybrid Bonding via MoS2 Passivation Layer" Nanomaterials 15, no. 20: 1600.
https://doi.org/10.3390/nano15201600
APA Style
Choi, H., Kim, K., Son, S., Lee, D., Je, S., Kang, J., Jeong, S., Kim, D. S., Lee, M., Kim, J., & Kim, T.
(2025). Cu-Contamination-Free Hybrid Bonding via MoS2 Passivation Layer. Nanomaterials, 15(20), 1600.
https://doi.org/10.3390/nano15201600