Shen, Y.; Fu, J.; Han, F.; Li, D.; Yang, B.; Tang, Y.
Interface Thermal Resistance in Heterostructures of Micro–Nano Power Devices: Current Status and Future Challenges. Nanomaterials 2025, 15, 1236.
https://doi.org/10.3390/nano15161236
AMA Style
Shen Y, Fu J, Han F, Li D, Yang B, Tang Y.
Interface Thermal Resistance in Heterostructures of Micro–Nano Power Devices: Current Status and Future Challenges. Nanomaterials. 2025; 15(16):1236.
https://doi.org/10.3390/nano15161236
Chicago/Turabian Style
Shen, Yinjie, Jia Fu, Fengguo Han, Dongbo Li, Bing Yang, and Yunqing Tang.
2025. "Interface Thermal Resistance in Heterostructures of Micro–Nano Power Devices: Current Status and Future Challenges" Nanomaterials 15, no. 16: 1236.
https://doi.org/10.3390/nano15161236
APA Style
Shen, Y., Fu, J., Han, F., Li, D., Yang, B., & Tang, Y.
(2025). Interface Thermal Resistance in Heterostructures of Micro–Nano Power Devices: Current Status and Future Challenges. Nanomaterials, 15(16), 1236.
https://doi.org/10.3390/nano15161236