Yang, J.; Wei, Q.; Luo, J.; Zhang, M.; Wei, B.
Structural Stability, Mechanical, and Electronic Properties of Al5TM (TM = Mo, Nb, Os, Re, Ru, Ta, Tc, Ti) Intermetallics. Nanomaterials 2025, 15, 1221.
https://doi.org/10.3390/nano15161221
AMA Style
Yang J, Wei Q, Luo J, Zhang M, Wei B.
Structural Stability, Mechanical, and Electronic Properties of Al5TM (TM = Mo, Nb, Os, Re, Ru, Ta, Tc, Ti) Intermetallics. Nanomaterials. 2025; 15(16):1221.
https://doi.org/10.3390/nano15161221
Chicago/Turabian Style
Yang, Jiaxiang, Qun Wei, Jing Luo, Meiguang Zhang, and Bing Wei.
2025. "Structural Stability, Mechanical, and Electronic Properties of Al5TM (TM = Mo, Nb, Os, Re, Ru, Ta, Tc, Ti) Intermetallics" Nanomaterials 15, no. 16: 1221.
https://doi.org/10.3390/nano15161221
APA Style
Yang, J., Wei, Q., Luo, J., Zhang, M., & Wei, B.
(2025). Structural Stability, Mechanical, and Electronic Properties of Al5TM (TM = Mo, Nb, Os, Re, Ru, Ta, Tc, Ti) Intermetallics. Nanomaterials, 15(16), 1221.
https://doi.org/10.3390/nano15161221