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Journal: Nanomaterials, 2024
Volume: 14
Number: 771

Article: Enhanced Nanotwinned Copper Bonding through Epoxy-Induced Copper Surface Modification
Authors: by Tsan-Feng Lu, Pei-Wen Wang, Yuan-Fu Cheng, Yu-Ting Yen and YewChung Sermon Wu
Link: https://www.mdpi.com/2079-4991/14/9/771

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