Chen, Y.-H.; Lee, P.-I.; Sakalley, S.; Wen, C.-K.; Cheng, W.-C.; Sun, H.; Chen, S.-C.
Enhanced Electrical Properties of Copper Nitride Films Deposited via High Power Impulse Magnetron Sputtering. Nanomaterials 2022, 12, 2814.
https://doi.org/10.3390/nano12162814
AMA Style
Chen Y-H, Lee P-I, Sakalley S, Wen C-K, Cheng W-C, Sun H, Chen S-C.
Enhanced Electrical Properties of Copper Nitride Films Deposited via High Power Impulse Magnetron Sputtering. Nanomaterials. 2022; 12(16):2814.
https://doi.org/10.3390/nano12162814
Chicago/Turabian Style
Chen, Yin-Hung, Pei-Ing Lee, Shikha Sakalley, Chao-Kuang Wen, Wei-Chun Cheng, Hui Sun, and Sheng-Chi Chen.
2022. "Enhanced Electrical Properties of Copper Nitride Films Deposited via High Power Impulse Magnetron Sputtering" Nanomaterials 12, no. 16: 2814.
https://doi.org/10.3390/nano12162814
APA Style
Chen, Y.-H., Lee, P.-I., Sakalley, S., Wen, C.-K., Cheng, W.-C., Sun, H., & Chen, S.-C.
(2022). Enhanced Electrical Properties of Copper Nitride Films Deposited via High Power Impulse Magnetron Sputtering. Nanomaterials, 12(16), 2814.
https://doi.org/10.3390/nano12162814