Takeshita, J.; Aoki, S.; Wada, R.; Osawa, A.; Sawai, J.
Antimicrobial Properties of a Copper/Silicone Composite Membrane Prepared Using a Two-Step Immersion Process in Iodine and Copper Sulfate Solutions. Membranes 2022, 12, 1049.
https://doi.org/10.3390/membranes12111049
AMA Style
Takeshita J, Aoki S, Wada R, Osawa A, Sawai J.
Antimicrobial Properties of a Copper/Silicone Composite Membrane Prepared Using a Two-Step Immersion Process in Iodine and Copper Sulfate Solutions. Membranes. 2022; 12(11):1049.
https://doi.org/10.3390/membranes12111049
Chicago/Turabian Style
Takeshita, Junpei, Shiho Aoki, Risei Wada, Ayako Osawa, and Jun Sawai.
2022. "Antimicrobial Properties of a Copper/Silicone Composite Membrane Prepared Using a Two-Step Immersion Process in Iodine and Copper Sulfate Solutions" Membranes 12, no. 11: 1049.
https://doi.org/10.3390/membranes12111049
APA Style
Takeshita, J., Aoki, S., Wada, R., Osawa, A., & Sawai, J.
(2022). Antimicrobial Properties of a Copper/Silicone Composite Membrane Prepared Using a Two-Step Immersion Process in Iodine and Copper Sulfate Solutions. Membranes, 12(11), 1049.
https://doi.org/10.3390/membranes12111049