Lin, J.-H.; Chuang, Y.-C.; Huang, C.-H.; Li, T.-T.; Huang, C.-L.; Chen, Y.-S.; Lou, C.-W.
Needle-Bonded Electromagnetic Shielding Thermally Insulating Nonwoven Composite Boards: Property Evaluations. Appl. Sci. 2016, 6, 303.
https://doi.org/10.3390/app6100303
AMA Style
Lin J-H, Chuang Y-C, Huang C-H, Li T-T, Huang C-L, Chen Y-S, Lou C-W.
Needle-Bonded Electromagnetic Shielding Thermally Insulating Nonwoven Composite Boards: Property Evaluations. Applied Sciences. 2016; 6(10):303.
https://doi.org/10.3390/app6100303
Chicago/Turabian Style
Lin, Jia-Horng, Yu-Chun Chuang, Chen-Hung Huang, Ting-Ting Li, Chien-Lin Huang, Yueh-Sheng Chen, and Ching-Wen Lou.
2016. "Needle-Bonded Electromagnetic Shielding Thermally Insulating Nonwoven Composite Boards: Property Evaluations" Applied Sciences 6, no. 10: 303.
https://doi.org/10.3390/app6100303
APA Style
Lin, J.-H., Chuang, Y.-C., Huang, C.-H., Li, T.-T., Huang, C.-L., Chen, Y.-S., & Lou, C.-W.
(2016). Needle-Bonded Electromagnetic Shielding Thermally Insulating Nonwoven Composite Boards: Property Evaluations. Applied Sciences, 6(10), 303.
https://doi.org/10.3390/app6100303