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Journal: Appl. Sci., 2023
Volume: 13
Number: 2215
Article:
CAE Prediction for Compression Behavior in Multi-Stacked Packages with an EPS-Based Cushioning System: Modeling of Compression and Compressive Creep Behavior
Authors:
by
Jong Min Park, Gun Yeop Lee, Dong Hyun Kim and Hyun Mo Jung
Link:
https://www.mdpi.com/2076-3417/13/4/2215
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