Article Versions Notes

Meng F, Zhang Z, Kang Y, Cui C, Wang D, Zhang X, Zhou W. Research on Defect Inspection Technology for Bump Height in Wafer-Level Packaging Based on the Triangulation Method. Applied Sciences. 2023; 13(3):1997. https://doi.org/10.3390/app13031997

Meng, Fanchang, Zili Zhang, Yanhui Kang, Chengjun Cui, Dezhao Wang, Xinxin Zhang, and Weihu Zhou. 2023. "Research on Defect Inspection Technology for Bump Height in Wafer-Level Packaging Based on the Triangulation Method" Applied Sciences 13, no. 3: 1997. https://doi.org/10.3390/app13031997

Meng, F., Zhang, Z., Kang, Y., Cui, C., Wang, D., Zhang, X., & Zhou, W. (2023). Research on Defect Inspection Technology for Bump Height in Wafer-Level Packaging Based on the Triangulation Method. Applied Sciences, 13(3), 1997. https://doi.org/10.3390/app13031997