Order Article Reprints
Journal: Appl. Sci., 2022
Volume: 12
Number: 5616
Article:
High-Throughput Cross-Technology Communication via Chip-Level Side Channel
Authors:
by
Cheng Feng and Tian Xia
Link:
https://www.mdpi.com/2076-3417/12/11/5616
MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover
and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article
and designed to be complimentary to the journal.