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Journal: Appl. Sci., 2021
Volume: 11
Number: 1783

Article: Novel Abrasive-Impregnated Pads and Diamond Plates for the Grinding and Lapping of Single-Crystal Silicon Carbide Wafers
Authors: by Ming-Yi Tsai, Kun-Ying Li and Sun-Yu Ji
Link: https://www.mdpi.com/2076-3417/11/4/1783

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