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Journal: Applied SciencesVolume: 10Number: 8893
Article: Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and Temperature
  • Authors:
  • Zhao-Ying Wang1,
  • Nhat Minh Dang1 and
  • Po-Hsun Wang1
  • et al.
Link: https://www.mdpi.com/2076-3417/10/24/8893

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