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Journal: Buildings, 2023
Volume: 13
Number: 2404

Article: AppSimV: A Cyber–Physical Simulation and Verification Platform for Software Applications of Intelligent Buildings
Authors: by Haining Jia, Qiliang Yang, Ziyan Jiang, Wenjie Chen and Qizhen Zhou
Link: https://www.mdpi.com/2075-5309/13/10/2404

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