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Journal: MetalsVolume: 14Number: 139
Article: Identification and Evolution of Intermetallic Compounds Formed at the Interface between In-48Sn and Cu during Liquid Soldering Reactions
  • Authors:
  • Panju Shang1,
  • Feifei Tian1,2 and
  • Zhi-Quan Liu1,3,*
Link: https://www.mdpi.com/2075-4701/14/2/139

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