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Journal: Metals, 2022
Volume: 12
Number: 1594
1594
Article: Effect of in Addition on Thermodynamic Properties, Wettability, Interface Microstructure, and Soldering Performance of SnBiAg–xIn/Cu Solder Joints
Authors: by Bingwei Shen, Shangrong Yang, Mingyue Xu, Jincheng Zhao, Guohua Liu, Ming Xie and Qiao Zhang
Link: https://www.mdpi.com/2075-4701/12/10/1594

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