Kim, S.J.; Jeong, S.; Byun, T.; Kim, J.S.; Lee, H.; Kim, S.Y.
Transparent Poly(amide-imide)s with Low Coefficient of Thermal Expansion from Trifluoromethylated Trimellitic Anhydride. Polymers 2025, 17, 309.
https://doi.org/10.3390/polym17030309
AMA Style
Kim SJ, Jeong S, Byun T, Kim JS, Lee H, Kim SY.
Transparent Poly(amide-imide)s with Low Coefficient of Thermal Expansion from Trifluoromethylated Trimellitic Anhydride. Polymers. 2025; 17(3):309.
https://doi.org/10.3390/polym17030309
Chicago/Turabian Style
Kim, Seong Jong, SeongUk Jeong, Taejoon Byun, Jun Sung Kim, Haeshin Lee, and Sang Youl Kim.
2025. "Transparent Poly(amide-imide)s with Low Coefficient of Thermal Expansion from Trifluoromethylated Trimellitic Anhydride" Polymers 17, no. 3: 309.
https://doi.org/10.3390/polym17030309
APA Style
Kim, S. J., Jeong, S., Byun, T., Kim, J. S., Lee, H., & Kim, S. Y.
(2025). Transparent Poly(amide-imide)s with Low Coefficient of Thermal Expansion from Trifluoromethylated Trimellitic Anhydride. Polymers, 17(3), 309.
https://doi.org/10.3390/polym17030309