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Journal: Polymers, 2024
Volume: 16
Number: 2139

Article: Constructing Heterostructured MWCNT-BN Hybrid Fillers in Electrospun TPU Films to Achieve Superior Thermal Conductivity and Electrical Insulation Properties
Authors: by Yang Zhang, Shichang Wang, Hong Wu and Shaoyun Guo
Link: https://www.mdpi.com/2073-4360/16/15/2139

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