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Journal: PolymersVolume: 16Number: 2139
Article: Constructing Heterostructured MWCNT-BN Hybrid Fillers in Electrospun TPU Films to Achieve Superior Thermal Conductivity and Electrical Insulation Properties
  • Authors:
  • Yang Zhang†,
  • Shichang Wang† and
  • Shaoyun Guo
Link: https://www.mdpi.com/2073-4360/16/15/2139

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