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Journal: PolymersVolume: 15Number: 1072
Article: Thermal and Mechanical Characterization of Epoxy/Polyimide Blends via Postcuring Process
  • Authors:
  • Yong-Min Lee1,
  • Kwan-Woo Kim1,* and
  • Byung-Joo Kim2,*
Link: https://www.mdpi.com/2073-4360/15/5/1072

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