Lin, Z.; Chen, H.; Li, S.; Li, X.; Wang, J.; Xu, S.
Electrospun Food Polysaccharides Loaded with Bioactive Compounds: Fabrication, Release, and Applications. Polymers 2023, 15, 2318.
https://doi.org/10.3390/polym15102318
AMA Style
Lin Z, Chen H, Li S, Li X, Wang J, Xu S.
Electrospun Food Polysaccharides Loaded with Bioactive Compounds: Fabrication, Release, and Applications. Polymers. 2023; 15(10):2318.
https://doi.org/10.3390/polym15102318
Chicago/Turabian Style
Lin, Zhenyu, Hao Chen, Shengmei Li, Xiaolu Li, Jie Wang, and Shanshan Xu.
2023. "Electrospun Food Polysaccharides Loaded with Bioactive Compounds: Fabrication, Release, and Applications" Polymers 15, no. 10: 2318.
https://doi.org/10.3390/polym15102318
APA Style
Lin, Z., Chen, H., Li, S., Li, X., Wang, J., & Xu, S.
(2023). Electrospun Food Polysaccharides Loaded with Bioactive Compounds: Fabrication, Release, and Applications. Polymers, 15(10), 2318.
https://doi.org/10.3390/polym15102318