Li, K.; Ding, J.; Guo, Y.; Wu, H.; Wang, W.; Ji, J.; Pei, Q.; Gong, C.; Ji, Z.; Wang, X.
Direct Ink Writing of Phenylethynyl End-Capped Oligoimide/SiO2 to Additively Manufacture High-Performance Thermosetting Polyimide Composites. Polymers 2022, 14, 2669.
https://doi.org/10.3390/polym14132669
AMA Style
Li K, Ding J, Guo Y, Wu H, Wang W, Ji J, Pei Q, Gong C, Ji Z, Wang X.
Direct Ink Writing of Phenylethynyl End-Capped Oligoimide/SiO2 to Additively Manufacture High-Performance Thermosetting Polyimide Composites. Polymers. 2022; 14(13):2669.
https://doi.org/10.3390/polym14132669
Chicago/Turabian Style
Li, Keda, Jinghong Ding, Yuxiong Guo, Hongchao Wu, Wenwen Wang, Jiaqi Ji, Qi Pei, Chenliang Gong, Zhongying Ji, and Xiaolong Wang.
2022. "Direct Ink Writing of Phenylethynyl End-Capped Oligoimide/SiO2 to Additively Manufacture High-Performance Thermosetting Polyimide Composites" Polymers 14, no. 13: 2669.
https://doi.org/10.3390/polym14132669
APA Style
Li, K., Ding, J., Guo, Y., Wu, H., Wang, W., Ji, J., Pei, Q., Gong, C., Ji, Z., & Wang, X.
(2022). Direct Ink Writing of Phenylethynyl End-Capped Oligoimide/SiO2 to Additively Manufacture High-Performance Thermosetting Polyimide Composites. Polymers, 14(13), 2669.
https://doi.org/10.3390/polym14132669
