Pan, K.; Chen, Z.; Liu, M.; Ke, Z.; Wang, B.; He, K.; Huang, W.; He, S.
Effect of Current Density on Shear Performance and Fracture Behavior of Cu/Sn-58Bi/Cu Solder Joints. Crystals 2025, 15, 945.
https://doi.org/10.3390/cryst15110945
AMA Style
Pan K, Chen Z, Liu M, Ke Z, Wang B, He K, Huang W, He S.
Effect of Current Density on Shear Performance and Fracture Behavior of Cu/Sn-58Bi/Cu Solder Joints. Crystals. 2025; 15(11):945.
https://doi.org/10.3390/cryst15110945
Chicago/Turabian Style
Pan, Kailin, Zimeng Chen, Menghao Liu, Zhanglong Ke, Bo Wang, Kaixuan He, Wei Huang, and Siliang He.
2025. "Effect of Current Density on Shear Performance and Fracture Behavior of Cu/Sn-58Bi/Cu Solder Joints" Crystals 15, no. 11: 945.
https://doi.org/10.3390/cryst15110945
APA Style
Pan, K., Chen, Z., Liu, M., Ke, Z., Wang, B., He, K., Huang, W., & He, S.
(2025). Effect of Current Density on Shear Performance and Fracture Behavior of Cu/Sn-58Bi/Cu Solder Joints. Crystals, 15(11), 945.
https://doi.org/10.3390/cryst15110945
