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Journal: Crystals, 2024
Volume: 14
Number: 269

Article: Mechanical Response of Cu/Sn58Bi-xNi/Cu Micro Solder Joint with High Temperatures
Authors: by Xiangxia Kong, Junjun Zhai, Ruipeng Ma, Fenglian Sun and Xuemei Li
Link: https://www.mdpi.com/2073-4352/14/3/269

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