Shu, Y.; Zhang, S.; Xiong, Y.; Luo, X.; He, J.; Yin, C.; Ding, X.; Zheng, K.
Interfacial Stabilities, Electronic Properties and Interfacial Fracture Mechanism of 6H-SiC Reinforced Copper Matrix Studied by the First Principles Method. Crystals 2022, 12, 51.
https://doi.org/10.3390/cryst12010051
AMA Style
Shu Y, Zhang S, Xiong Y, Luo X, He J, Yin C, Ding X, Zheng K.
Interfacial Stabilities, Electronic Properties and Interfacial Fracture Mechanism of 6H-SiC Reinforced Copper Matrix Studied by the First Principles Method. Crystals. 2022; 12(1):51.
https://doi.org/10.3390/cryst12010051
Chicago/Turabian Style
Shu, Yao, Shaowen Zhang, Yongnan Xiong, Xing Luo, Jiazhen He, Cuicui Yin, Xiaoyong Ding, and Kaihong Zheng.
2022. "Interfacial Stabilities, Electronic Properties and Interfacial Fracture Mechanism of 6H-SiC Reinforced Copper Matrix Studied by the First Principles Method" Crystals 12, no. 1: 51.
https://doi.org/10.3390/cryst12010051
APA Style
Shu, Y., Zhang, S., Xiong, Y., Luo, X., He, J., Yin, C., Ding, X., & Zheng, K.
(2022). Interfacial Stabilities, Electronic Properties and Interfacial Fracture Mechanism of 6H-SiC Reinforced Copper Matrix Studied by the First Principles Method. Crystals, 12(1), 51.
https://doi.org/10.3390/cryst12010051