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Journal: Crystals, 2021
Volume: 11
Number: 441
Article:
Study on Creep Damage in Sn60Pb40 and Sn3.8Ag0.7Cu (Lead-Free) Solders in c-Si Solar PV Cell Interconnections under In-Situ Thermal Cycling in Ghana
Authors:
by
Frank Kwabena Afriyie Nyarko, Gabriel Takyi and Francis Boafo Effah
Link:
https://www.mdpi.com/2073-4352/11/4/441
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