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Journal: CrystalsVolume: 11Number: 441
Article: Study on Creep Damage in Sn60Pb40 and Sn3.8Ag0.7Cu (Lead-Free) Solders in c-Si Solar PV Cell Interconnections under In-Situ Thermal Cycling in Ghana
  • Authors:
  • Frank Kwabena Afriyie Nyarko1,*,
  • Gabriel Takyi1 and
  • Francis Boafo Effah2
Link: https://www.mdpi.com/2073-4352/11/4/441

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