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Journal: MicromachinesVolume: 14Number: 1766
Article: Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching
- Authors:
- Jonghyeok Kim1,2,
- Sungil Kim1 and
- Byungjoo Kim1
- et al.
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