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Journal: MicromachinesVolume: 14Number: 1493
Article: Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV Array
  • Authors:
  • Xianglong Wang1,†,
  • Jiaming Su1,† and
  • Dongdong Chen1,*
  • et al.
Link: https://www.mdpi.com/2072-666X/14/8/1493

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