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Journal: MicromachinesVolume: 13Number: 1537
Article: Height Uniformity Simulation and Experimental Study of Electroplating Gold Bump for 2.5D/3D Integrated Packaging
  • Authors:
  • Wenchao Tian1,*,
  • Zhao Li1 and
  • Yongkun Wang1
  • et al.
Link: https://www.mdpi.com/2072-666X/13/9/1537

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