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Journal: Micromachines, 2018
Volume: 9
Number: 317

Article: Encapsulation of NEM Memory Switches for Monolithic-Three-Dimensional (M3D) CMOS–NEM Hybrid Circuits
Authors: by Hyun Chan Jo and Woo Young Choi
Link: https://www.mdpi.com/2072-666X/9/7/317

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