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Journal: Micromachines, 2018
Volume: 9
Number: 528
Article:
Fabrication and Optimization of High Aspect Ratio Through-Silicon-Vias Electroplating for 3D Inductor
Authors:
by
Haiwang Li, Jiasi Liu, Tiantong Xu, Jingchao Xia, Xiao Tan and Zhi Tao
Link:
https://www.mdpi.com/2072-666X/9/10/528
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