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Journal: Micromachines, 2016
Volume: 7
Number: 211
Article:
An Interference-Assisted Thermal Bonding Method for the Fabrication of Thermoplastic Microfluidic Devices
Authors:
by
Yao Gong, Jang Min Park and Jiseok Lim
Link:
https://www.mdpi.com/2072-666X/7/11/211
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