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Journal: Micromachines, 2025
Volume: 16
Number: 824

Article: Encapsulation Process and Dynamic Characterization of SiC Half-Bridge Power Module: Electro-Thermal Co-Design and Experimental Validation
Authors: by Kaida Cai, Jing Xiao, Xingwei Su, Qiuhui Tang and Huayuan Deng
Link: https://www.mdpi.com/2072-666X/16/7/824

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