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Journal: Micromachines, 2025
Volume: 16
Number: 766
766
Article: SPICE-Compatible Degradation Modeling Framework for TDDB and LER Effects in Advanced Packaging BEOL Based on Ion Migration Mechanism
Authors: by Shao-Chun Zhang, Sen-Sen Li, Ying Ji, Ning Yang, Yuan-Hao Shan, Li Hong, Hao-Gang Wang, Wen-Sheng Zhao and Da-Wei Wang
Link: https://www.mdpi.com/2072-666X/16/7/766

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