Li, A.;                     Wang, H.;                     Hu, S.;                     Zhou, Y.;                     Du, J.;                     Ji, L.;                     Ming, W.    
        A Systematic Review of Modeling and Simulation for Precision Diamond Wire Sawing of Monocrystalline Silicon. Micromachines 2024, 15, 1041.
    https://doi.org/10.3390/mi15081041
    AMA Style
    
                                Li A,                                 Wang H,                                 Hu S,                                 Zhou Y,                                 Du J,                                 Ji L,                                 Ming W.        
                A Systematic Review of Modeling and Simulation for Precision Diamond Wire Sawing of Monocrystalline Silicon. Micromachines. 2024; 15(8):1041.
        https://doi.org/10.3390/mi15081041
    
    Chicago/Turabian Style
    
                                Li, Ansheng,                                 Hongyan Wang,                                 Shunchang Hu,                                 Yu Zhou,                                 Jinguang Du,                                 Lianqing Ji,                                 and Wuyi Ming.        
                2024. "A Systematic Review of Modeling and Simulation for Precision Diamond Wire Sawing of Monocrystalline Silicon" Micromachines 15, no. 8: 1041.
        https://doi.org/10.3390/mi15081041
    
    APA Style
    
                                Li, A.,                                 Wang, H.,                                 Hu, S.,                                 Zhou, Y.,                                 Du, J.,                                 Ji, L.,                                 & Ming, W.        
        
        (2024). A Systematic Review of Modeling and Simulation for Precision Diamond Wire Sawing of Monocrystalline Silicon. Micromachines, 15(8), 1041.
        https://doi.org/10.3390/mi15081041