Li, A.; Wang, H.; Hu, S.; Zhou, Y.; Du, J.; Ji, L.; Ming, W.
A Systematic Review of Modeling and Simulation for Precision Diamond Wire Sawing of Monocrystalline Silicon. Micromachines 2024, 15, 1041.
https://doi.org/10.3390/mi15081041
AMA Style
Li A, Wang H, Hu S, Zhou Y, Du J, Ji L, Ming W.
A Systematic Review of Modeling and Simulation for Precision Diamond Wire Sawing of Monocrystalline Silicon. Micromachines. 2024; 15(8):1041.
https://doi.org/10.3390/mi15081041
Chicago/Turabian Style
Li, Ansheng, Hongyan Wang, Shunchang Hu, Yu Zhou, Jinguang Du, Lianqing Ji, and Wuyi Ming.
2024. "A Systematic Review of Modeling and Simulation for Precision Diamond Wire Sawing of Monocrystalline Silicon" Micromachines 15, no. 8: 1041.
https://doi.org/10.3390/mi15081041
APA Style
Li, A., Wang, H., Hu, S., Zhou, Y., Du, J., Ji, L., & Ming, W.
(2024). A Systematic Review of Modeling and Simulation for Precision Diamond Wire Sawing of Monocrystalline Silicon. Micromachines, 15(8), 1041.
https://doi.org/10.3390/mi15081041